Invention Grant
- Patent Title: System and method for creating a ground bonding strap
- Patent Title (中): 用于创建接地带的系统和方法
-
Application No.: US12410247Application Date: 2009-03-24
-
Publication No.: US08453486B2Publication Date: 2013-06-04
- Inventor: Matthew Aaron Munn , Doug Klamm
- Applicant: Matthew Aaron Munn , Doug Klamm
- Applicant Address: US CO Denver
- Assignee: CenturyLink Intellectual Property LLC
- Current Assignee: CenturyLink Intellectual Property LLC
- Current Assignee Address: US CO Denver
- Agency: Swanson & Bratschun, L.L.C.
- Main IPC: B21D38/00
- IPC: B21D38/00

Abstract:
A system and method forming a ground bonding strap. A length of cable is measured to determine a segment of cable to stamp to form a pair of connectors. The segment is heated. The segment is stamped to form the pair of connectors. The pair of connectors defining an indentation and a pair of receptacles disposed through the cable. The pair of receptacles being each adjacent to and separated by an indentation. The indentations being positioned to allow a user to cut between the pair of connectors to form a ground bonding strap of a length selected by the user.
Public/Granted literature
- US20090282888A1 SYSTEM AND METHOD FOR CREATING A GROUND BONDING STRAP Public/Granted day:2009-11-19
Information query