Invention Grant
- Patent Title: Electronic device enclosure
- Patent Title (中): 电子设备外壳
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Application No.: US13632404Application Date: 2012-10-01
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Publication No.: US08453837B1Publication Date: 2013-06-04
- Inventor: Fu-Ming Liu
- Applicant: Fu-Ming Liu
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110441245 20111226
- Main IPC: B65D85/30
- IPC: B65D85/30

Abstract:
An electronic device enclosure includes a side plate, a fixing member, and a handle pivotally mounted on the fixing member. The side plate defines a depression portion therein. The fixing member is mounted in the depression portion. The fixing member includes two fixing portions and at least one elastically resisting portion. The two fixing portions are aligned in a line. The handle includes two mounting portions extending in the two fixing portions in a first direction. The at least one elastically resisting portion abuts the handle to prevent the handle from moving out of the two fixing portions in a second direction that is opposite to the first direction.
Public/Granted literature
- US20130162130A1 ELECTRONIC DEVICE ENCLOSURE Public/Granted day:2013-06-27
Information query
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