Invention Grant
- Patent Title: Fluid filled vibration damping device
- Patent Title (中): 流体填充减震装置
-
Application No.: US12222020Application Date: 2008-07-31
-
Publication No.: US08454002B2Publication Date: 2013-06-04
- Inventor: Naoki Nishi , Tetsuya Miyahara
- Applicant: Naoki Nishi , Tetsuya Miyahara
- Applicant Address: JP Aichi JP Tokyo
- Assignee: Tokai Rubber Industries, Ltd.,Honda Motor Co., Ltd.
- Current Assignee: Tokai Rubber Industries, Ltd.,Honda Motor Co., Ltd.
- Current Assignee Address: JP Aichi JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-210139 20070810
- Main IPC: F16F5/00
- IPC: F16F5/00 ; F16F9/00

Abstract:
A fluid filled vibration damping device having an orifice passage formed in a partition member to connect a pressure receiving chamber and an equilibrium chamber, wherein a first end section of the orifice passage extends in along a plane of the partition member, and a communication hole is formed to bend at a right angle from the first end of the orifice passage and open towards the pressure receiving chamber to form a dead water region by orthogonal wall faces of a terminal end face and a bottom face of the orifice passage in a connecting corner section of the orifice passage with the communication hole. A shunt hole of smaller cross-sectional area than the orifice passage and the communication hole is formed in a bottom wall so that the pressure receiving chamber and the equilibrium chamber communicate through the shunt hole in the dead water region.
Public/Granted literature
- US20090038896A1 Fluid filled type vibration damping device Public/Granted day:2009-02-12
Information query