Invention Grant
- Patent Title: Printhead support structure including thermal insulator
- Patent Title (中): 打印支撑结构包括绝热体
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Application No.: US13217715Application Date: 2011-08-25
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Publication No.: US08454108B2Publication Date: 2013-06-04
- Inventor: Mikhail Fishkin , Andrew Ciaschi , Jinquan Xu
- Applicant: Mikhail Fishkin , Andrew Ciaschi , Jinquan Xu
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent William R. Zimmerli
- Main IPC: B41J25/308
- IPC: B41J25/308
Abstract:
A printing system includes a plurality of inkjet printheads for printing on a print media that is moved relative to the plurality of printheads and a support structure for locating the plurality of printheads relative to the print media. The support structure includes a face adjacent to the print media. The face of the support structure includes a thermal insulator.
Public/Granted literature
- US20130050348A1 PRINTHEAD SUPPORT STRUCTURE INCLUDING THERMAL INSULATOR Public/Granted day:2013-02-28
Information query
IPC分类:
