Invention Grant
- Patent Title: LED module
- Patent Title (中): LED模块
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Application No.: US13074477Application Date: 2011-03-29
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Publication No.: US08454199B2Publication Date: 2013-06-04
- Inventor: Jianwei Deng
- Applicant: Jianwei Deng
- Agency: Clement Cheng
- Main IPC: H01L33/48
- IPC: H01L33/48

Abstract:
A LED module has a LED chip, LED packaging materials, a metal base circuit board, a power connection cable, a heat sink that also functions as a metal case; and an optional potting material. The LED chip is fixed to the metal base close to the surface of the board. The LED packaging materials forms a package. A power connection line has a continuous uninterrupted power supply line. A continuous power cord from the power connection line is mounted on the metal injection molded parts corresponding fixed location. Self-tapping screws are mounted to the metal base circuit board. The self-tapping screws are formed of metal. A plastic end connector cap is for the power cord. The power connection cable passes through the plastic end connector cap and joins together with the metal case to form a fixed electrical connection by connecting to the power connection cable.
Public/Granted literature
- US20120097988A1 LED Module Public/Granted day:2012-04-26
Information query
IPC分类: