Invention Grant
- Patent Title: Mounting structure for a sensor
- Patent Title (中): 传感器的安装结构
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Application No.: US12376684Application Date: 2006-08-09
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Publication No.: US08454231B2Publication Date: 2013-06-04
- Inventor: Merle D. Sears , William Bruce Sutherlin
- Applicant: Merle D. Sears , William Bruce Sutherlin
- Applicant Address: US CT Farmington
- Assignee: Carrier Corporation
- Current Assignee: Carrier Corporation
- Current Assignee Address: US CT Farmington
- Agency: Cantor Colburn LLP
- International Application: PCT/US2006/030949 WO 20060809
- International Announcement: WO2008/018868 WO 20080214
- Main IPC: G01K1/14
- IPC: G01K1/14 ; G01K7/22
Abstract:
A mounting structure (34) for receiving a sensor (18) having a sensing portion (26) and a base portion (30) includes a substantially flat sheet of material (20) having a first surface (20a), a second surface (20b) opposite the first surface (20a), and an aperture (36). The aperture (36) is configured such that the sensing portion (26) of the sensor (18) is passable through the aperture (36), and the base portion (30) is not passable through the aperture (36), but instead rests on the first surface (20a). The mounting structure (34) also includes a pair of tabs (38) that extend in a downward direction away from the second surface (20b) of the sheet of material (20) and are configured to immobilize the sensor (18) within the aperture (36).
Public/Granted literature
- US20100176912A1 MOUNTING STRUCTURE FOR A SENSOR Public/Granted day:2010-07-15
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