A modular mold clamp assembly for use in a molding machine. The assembly has a frame with a base member and oppositely-facing end members, with the oppositely-facing end members having mounting areas provided thereon. First and second platens are movably mounted on the base member between an open and a closed position. The platens are mounted on the frame and are movable relative to the frame without transmitting forces to the frame. The frame, containing the platens, can be mounted or unmounted to the molding machine by the use of mounting hardware cooperating with the mounting area of the frame.