Invention Grant
- Patent Title: Modular prosthesis rasp
- Patent Title (中): 模块化假体锉
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Application No.: US12974496Application Date: 2010-12-21
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Publication No.: US08454611B2Publication Date: 2013-06-04
- Inventor: Stefan Wallstein , Joerg Fritzsche
- Applicant: Stefan Wallstein , Joerg Fritzsche
- Applicant Address: DE Tuttlingen
- Assignee: Aesculap AG
- Current Assignee: Aesculap AG
- Current Assignee Address: DE Tuttlingen
- Agency: Lipsitz & McAllister, LLC
- Priority: DE102009059314 20091223; DE102010000419 20100215
- Main IPC: A61B17/00
- IPC: A61B17/00

Abstract:
A modular prosthesis rasp is provided, having a rasp body with a rasp main body and at least one modular rasp body part connectable to the main body. The rasp main body has a receptacle for receiving the at least one rasp body part. An outer contour is defined by the rasp main body and the at least one rasp body part. The rasp body part receptacle extends from an indentation, defining a distal end of the receptacle, on a lateral side of the rasp main body to a proximal end thereof. A first tangential plane of the lateral side of the outer contour in the region of the indentation and a second tangential plane at a rasp body part contact surface, in the region of the distal end of the receptacle include an indentation angle of less than 85°.
Public/Granted literature
- US20110160733A1 Modular prosthesis rasp Public/Granted day:2011-06-30
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