Invention Grant
- Patent Title: Percutaneous spinal implants and methods
- Patent Title (中): 经皮脊髓植入物和方法
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Application No.: US13033915Application Date: 2011-02-24
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Publication No.: US08454693B2Publication Date: 2013-06-04
- Inventor: Hugues F. Malandain , Avram Allan Edidin
- Applicant: Hugues F. Malandain , Avram Allan Edidin
- Applicant Address: CH Neuchatel
- Assignee: Kyphon SARL
- Current Assignee: Kyphon SARL
- Current Assignee Address: CH Neuchatel
- Agency: Sorell, Lenna and Schmidt LLP
- Main IPC: A61F2/44
- IPC: A61F2/44
Abstract:
A method includes moving a spinal implant such that a central portion of the spinal implant is disposed between adjacent spinous processes, radially extending a proximal portion of the spinal implant on a first side of the adjacent spinous processes such that movement of the proximal portion between the adjacent spinous processes is inhibited, and radially extending a distal portion of the spinal implant on a second side of the adjacent spinous processes opposite the first side such that movement of the distal portion between the adjacent spinous processes is inhibited.
Public/Granted literature
- US20110144697A1 PERCUTANEOUS SPINAL IMPLANTS AND METHODS Public/Granted day:2011-06-16
Information query
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