Invention Grant
- Patent Title: Bond and stitch repair for delaminated composite
- Patent Title (中): 分层复合材料的粘合和缝合修复
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Application No.: US13194095Application Date: 2011-07-29
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Publication No.: US08454775B2Publication Date: 2013-06-04
- Inventor: Daniel M. Stadtlander
- Applicant: Daniel M. Stadtlander
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Hartford
- Agency: Kinney & Lange, P.A.
- Main IPC: F04D29/38
- IPC: F04D29/38

Abstract:
A method of repairing delaminated plies of a composite includes drilling a plurality of holes in the plies, stitching one or more tows into the plurality of holes, and tensioning the tows. The holes are disposed across an area of the plies that is delaminated. The method introduces a resin into the area of the plies that is delaminated and cures the resin. Curing of the composite can be performed prior to the stitching and the tensioning of the one or more tows and can be performed by the tensioning of the one or more tows. Optionally, one or more additional plies can be applied to the repaired area and/or a portion of the one or more tows that extends above a surface the plies can be removed.
Public/Granted literature
- US20130025769A1 BOND AND STITCH REPAIR FOR DELAMINATED COMPOSITE Public/Granted day:2013-01-31
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