Invention Grant
- Patent Title: Method and apparatus for placing short courses of composite tape
- Patent Title (中): 放置复合胶带短路的方法和装置
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Application No.: US12404265Application Date: 2009-03-13
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Publication No.: US08454788B2Publication Date: 2013-06-04
- Inventor: Robert A. Kisch
- Applicant: Robert A. Kisch
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B65H81/00
Abstract:
An automatic composite tape placement head includes a roller for compacting tape on a substrate, and a cutter adjacent the roller for cutting the tape at the roller.
Public/Granted literature
- US20100230043A1 Method and Apparatus for Placing Short Courses of Composite Tape Public/Granted day:2010-09-16
Information query
