Invention Grant
- Patent Title: Disposable bond gap control structures
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Application No.: US13031996Application Date: 2011-02-22
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Publication No.: US08454789B2Publication Date: 2013-06-04
- Inventor: Buu Diep , Roland W. Gooch
- Applicant: Buu Diep , Roland W. Gooch
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B32B38/04 ; B29C65/99
Abstract:
In certain embodiments, a bond gap control structure (BGCS) is placed outwardly from a substrate. The BGCS is configured to control a geometry of a bond line of a joining material. The joining material is deposited outwardly from the substrate. The substrate is bonded to another substrate with the joining material. The BGCS is at least partially removed from the substrate.
Public/Granted literature
- US20120111492A1 Disposable Bond Gap Control Structures Public/Granted day:2012-05-10
Information query
