Invention Grant
US08454850B2 Method for the removal of surface oxides by electron attachment 有权
通过电子附着去除表面氧化物的方法

Method for the removal of surface oxides by electron attachment
Abstract:
Described herein are a method and an apparatus for removing metal oxides and/or forming solder joints on at least a portion of a substrate surface within a target area. In one particular embodiment, the method and apparatus form a solder joint within a substrate comprising a layer having a plurality of solder bumps by providing one or more energizing electrodes and exposing at least a portion of the layer and solder bumps to the energizing electrode.
Public/Granted literature
Information query
Patent Agency Ranking
0/0