Invention Grant
- Patent Title: Sensing device
- Patent Title (中): 感应装置
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Application No.: US13369506Application Date: 2012-02-09
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Publication No.: US08454902B2Publication Date: 2013-06-04
- Inventor: Hiroyuki Kukita , Shunichi Wakamatsu , Wakako Shinobu
- Applicant: Hiroyuki Kukita , Shunichi Wakamatsu , Wakako Shinobu
- Applicant Address: JP Tokyo
- Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Jordan and Hamburg LLP
- Priority: JP2011-038937 20110224
- Main IPC: G01N33/00
- IPC: G01N33/00

Abstract:
A sensing device is configured that a first piezoelectric vibrator and a second piezoelectric vibrator, changing over a connection to an oscillation circuit, have the oscillation circuit in common, that an impedance of a conductive path including a first one-surface-side electrode constituting the first piezoelectric vibrator from the oscillation circuit and an impedance of a conductive path including a second one-surface-side electrode constituting the second piezoelectric vibrator from the oscillation circuit are uniform with each other, and that an impedance of a conductive path including a first other-surface-side electrode constituting the first piezoelectric vibrator from the oscillation circuit and an impedance of a conductive path including a second other-surface-side electrode constituting the second piezoelectric vibrator from the oscillation circuit are uniform with each other.
Public/Granted literature
- US20120219458A1 SENSING DEVICE Public/Granted day:2012-08-30
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