Invention Grant
- Patent Title: Processed ECM materials with enhanced component profiles
- Patent Title (中): 加工的ECM材料具有增强的组件配置文件
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Application No.: US13488519Application Date: 2012-06-05
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Publication No.: US08455008B2Publication Date: 2013-06-04
- Inventor: Chad E. Johnson
- Applicant: Chad E. Johnson
- Applicant Address: US IN West Lafayette
- Assignee: Cook Biotech Incorporated
- Current Assignee: Cook Biotech Incorporated
- Current Assignee Address: US IN West Lafayette
- Agency: Woodard, Emhardt, Moriarty, McNett & Henry LLP
- Main IPC: A61F2/00
- IPC: A61F2/00 ; A61K35/37
Abstract:
Described are medical graft materials and devices having improved properties relating to their component profiles.
Public/Granted literature
- US20120308556A1 PROCESSED ECM MATERIALS WITH ENHANCED COMPONENT PROFILES Public/Granted day:2012-12-06
Information query
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