Invention Grant
US08455057B2 Method for controlling surface contact area of a paper or board substrate
有权
控制纸张或纸板基材表面接触面积的方法
- Patent Title: Method for controlling surface contact area of a paper or board substrate
- Patent Title (中): 控制纸张或纸板基材表面接触面积的方法
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Application No.: US12438492Application Date: 2007-08-24
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Publication No.: US08455057B2Publication Date: 2013-06-04
- Inventor: Isto Heiskanen , Kaj Backfolk
- Applicant: Isto Heiskanen , Kaj Backfolk
- Applicant Address: FI Helsinki
- Assignee: Stora Enso Oyj
- Current Assignee: Stora Enso Oyj
- Current Assignee Address: FI Helsinki
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: FI20060756 20060824
- International Application: PCT/FI2007/000211 WO 20070824
- International Announcement: WO2008/023092 WO 20080228
- Main IPC: B05D1/04
- IPC: B05D1/04

Abstract:
Method for controlling contact area of a paper or board substrate or a product thereof, by depositing electrostatically a trace amount of particles comprising boundary lubricants to form one or more layers on the surface of the substrate. The boundary lubricants are deposited to the target surface solubilized or dispersed in a suitable solvent or carrier. The particles comprise an agent providing one or more effects selected from: lyophilicity, lyophobicity, hydrophobicity, hydrophilicity, lipophilicity, lipophobicity, oleophobicity, oleophilicity, and boundary lubrication. Also, a paper or board substrate treated according to the foregoing method. The use of electrostatic deposition of coating materials described herein gives improved control on contact and surface characteristics.
Public/Granted literature
- US20100015460A1 METHOD FOR CONTROLLING SURFACE CONTACT AREA OF A PAPER OR BOARD SUBSTRATE Public/Granted day:2010-01-21
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