Invention Grant
- Patent Title: Pressure-sensitive adhesive sheet
- Patent Title (中): 压敏粘合片
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Application No.: US13637082Application Date: 2011-03-24
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Publication No.: US08455083B2Publication Date: 2013-06-04
- Inventor: Takashi Morioka , Naokl Taya
- Applicant: Takashi Morioka , Naokl Taya
- Applicant Address: JP Tokyo
- Assignee: Lintec Corporation
- Current Assignee: Lintec Corporation
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: JP2010-074900 20100329
- International Application: PCT/JP2011/057164 WO 20110324
- International Announcement: WO2011/122437 WO 20111006
- Main IPC: B32B3/10
- IPC: B32B3/10

Abstract:
A pressure-sensitive adhesive sheet includes a base material and a pressure-sensitive adhesive layer and is formed therein with a plurality of through-holes passing through from one surface to the other surface. The base material includes a first layer positioned on a side of the pressure-sensitive adhesive layer and a second layer positioned on an opposite side of the pressure-sensitive adhesive layer. The first layer includes a resin composition containing 50 to 88 wt % of a polyolefin-based resin (A); 10 to 48 wt % of a styrene-based resin and/or an acrylic-based resin (B) excluding the polyolefin-based resin (A); and 2.0 to 30 wt % of a pigment (C), and the second layer contains a polyolefin-based ionomer resin (D) as a main constituent, and the ratio of thickness between the first layer and the second layer is 80:20 to 97:3.0.
Public/Granted literature
- US20130040100A1 PRESSURE-SENSITIVE ADHESIVE SHEET Public/Granted day:2013-02-14
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