Invention Grant
- Patent Title: Multi-stack ferroelectric polymer memory
- Patent Title (中): 多堆铁电聚合物记忆体
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Application No.: US12026330Application Date: 2008-02-05
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Publication No.: US08455266B2Publication Date: 2013-06-04
- Inventor: Sunil Madhukar Bhangale , Takehisa Ishida
- Applicant: Sunil Madhukar Bhangale , Takehisa Ishida
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: SG200703050-5 20070503
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A memory device and method for manufacturing the memory device are provided. The memory device including a first electrode, a first ferroelectric polymer layer over the first electrode, a second electrode over the first ferroelectric polymer layer, a second ferroelectric polymer layer over the second electrode, a third electrode over the second ferroelectric polymer layer, and a protective layer between the first and second ferroelectric polymer layers. The first, second and third electrodes and the first and second ferroelectric polymer layers define first and second ferroelectric capacitor structures, the second electrode being common to the first and second ferroelectric capacitor structures.
Public/Granted literature
- US20080273367A1 MULTI-STACK FERROELECTRIC POLYMER MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2008-11-06
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