An exemplary method for manufacturing LEDs includes steps: providing a substrate and an epitaxial layer formed on the substrate; etching the epitaxial layer along a transverse direction thereof to divide the epitaxial layer into separated LED chips, and a groove defined between each two adjacent LED chips; providing insulating poles and inserting the insulating poles in the grooves; printing a solder paste layer on a top surface of each LED chip away from the substrate; reflow soldering the LED chips to make the solder paste layers mounted on the LED chips become solder balls; releasing the substrate from the LED chips; etching the insulating poles until the insulating poles are totally removed and the LED chips are separated from each other; and providing metallic plates and respectively soldering the metallic plates on the solder balls of the LED chips.