Invention Grant
US08455320B2 Inverted-trench grounded-source FET structure using conductive substrates, with highly doped substrates
有权
使用导电衬底的反向沟槽接地源FET结构,具有高度掺杂的衬底
- Patent Title: Inverted-trench grounded-source FET structure using conductive substrates, with highly doped substrates
- Patent Title (中): 使用导电衬底的反向沟槽接地源FET结构,具有高度掺杂的衬底
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Application No.: US13553152Application Date: 2012-07-19
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Publication No.: US08455320B2Publication Date: 2013-06-04
- Inventor: François Hébert
- Applicant: François Hébert
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee Address: US CA Sunnyvale
- Agent Bo-In Lin
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
This invention discloses an inverted field-effect-transistor (iT-FET) semiconductor device that includes a source disposed on a bottom and a drain disposed on a top of a semiconductor substrate. The semiconductor power device further comprises a trench-sidewall gate placed on sidewalls at a lower portion of a vertical trench surrounded by a body region encompassing a source region with a low resistivity body-source structure connected to a bottom source electrode and a drain link region disposed on top of said body regions thus constituting a drift region. The drift region is operated with a floating potential said iT-FET device achieving a self-termination.
Public/Granted literature
- US20120282746A1 INVERTED-TRENCH GROUNDED-SOURCE FET STRUCTURE USING CONDUCTIVE SUBSTRATES, WITH HIGHLY DOPED SUBSTRATES Public/Granted day:2012-11-08
Information query
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