Invention Grant
- Patent Title: Methods of forming features of integrated circuitry
- Patent Title (中): 形成集成电路特征的方法
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Application No.: US12874781Application Date: 2010-09-02
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Publication No.: US08455341B2Publication Date: 2013-06-04
- Inventor: Stephen W. Russell , Kyle A. Armstrong
- Applicant: Stephen W. Russell , Kyle A. Armstrong
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John, P.S.
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L21/3205

Abstract:
Methods of forming features such as word lines of memory circuitry are disclosed. One such method includes forming an initial pitch multiplied feature pattern extending from a target area into only one of a first or second periphery area received on opposing sides of the target area. Thereafter, a subsequent feature pattern is formed which extends from the target array area into the other of the first or second periphery area. The initial and subsequent feature patterns may be used in forming features in an underlying material which extend from the target area to the first and second periphery areas. Other embodiments are disclosed.
Public/Granted literature
- US20120058633A1 Methods Of Forming Features Of Integrated Circuitry Public/Granted day:2012-03-08
Information query
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