Invention Grant
- Patent Title: Mask ROM fabrication method
- Patent Title (中): 掩模ROM制作方法
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Application No.: US13274857Application Date: 2011-10-17
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Publication No.: US08455342B2Publication Date: 2013-06-04
- Inventor: Kuang-Chu Chen , Cheng Tao Chen , Chung-Lung Hsu , Chun-Yao Chiu , Chin-Yung Chang
- Applicant: Kuang-Chu Chen , Cheng Tao Chen , Chung-Lung Hsu , Chun-Yao Chiu , Chin-Yung Chang
- Applicant Address: TW Hsinchu TW Hsinchu
- Assignee: Nyquest Technology Corporation Limited,Nuvoton Technology Corporation
- Current Assignee: Nyquest Technology Corporation Limited,Nuvoton Technology Corporation
- Current Assignee Address: TW Hsinchu TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: H01L21/3205
- IPC: H01L21/3205

Abstract:
A mask ROM fabrication method which comprises steps: sequentially forming a gate dielectric layer and a first photoresist layer on a substrate; letting a light having a wavelength of 365 nm pass through a first phase shift mask to photolithographically form on the first photoresist layer a plurality of first trenches having a width of 243-365 nm; doping the substrate to form a plurality of embedded bit lines having a width of 243-365 nm; removing the first photoresist layer; sequentially forming a polysilicon layer and a second photoresist layer on the gate dielectric layer; and letting the light pass through a second phase shift mask to photolithographically form a plurality of polysilicon word lines on the polysilicon layer. Thereby is reduced the line width of mask ROM to 243-365 nm and decreased the area of mask ROM.
Public/Granted literature
- US20130095628A1 MASK ROM FABRICATION METHOD Public/Granted day:2013-04-18
Information query
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