Invention Grant
- Patent Title: Fungicidal compositions including hydrazone derivatives and copper
- Patent Title (中): 杀真菌组合物包括腙衍生物和铜
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Application No.: US13144679Application Date: 2010-01-14
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Publication No.: US08455394B2Publication Date: 2013-06-04
- Inventor: David H. Young , Steven Howard Shaber , Cruz Avila-Adame , Nneka T. Breaux , James M. Ruiz , Thomas L. Siddall , Jeffery D. Webster
- Applicant: David H. Young , Cruz Avila-Adame , Nneka T. Breaux , James M. Ruiz , Thomas L. Siddall , Jeffery D. Webster , Gerald Shaber
- Applicant Address: US IN Indianapolis
- Assignee: Dow AgroSciences, LLC
- Current Assignee: Dow AgroSciences, LLC
- Current Assignee Address: US IN Indianapolis
- Agency: Faegre Baker Daniels, LLP
- Agent C. W. Arnett
- International Application: PCT/US2010/021055 WO 20100114
- International Announcement: WO2010/083318 WO 20100722
- Main IPC: A01N25/26
- IPC: A01N25/26 ; A01N41/00 ; C07C245/00
Abstract:
The present invention relates to the use of hydrazone compounds and copper for controlling the growth of fungi.
Public/Granted literature
- US20120021065A1 FUNGICIDAL COMPOSITIONS INCLUDING HYDRAZONE DERIVATIVES AND COPPER Public/Granted day:2012-01-26
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