Invention Grant
- Patent Title: Methods of use of skin wound healing compositions
- Patent Title (中): 使用皮肤伤口愈合组合物的方法
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Application No.: US13484162Application Date: 2012-05-30
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Publication No.: US08455443B2Publication Date: 2013-06-04
- Inventor: Wei Li , Mei Chen , David T. Woodley , Chieh-Fang Cheng
- Applicant: Wei Li , Mei Chen , David T. Woodley , Chieh-Fang Cheng
- Applicant Address: US CA Los Angeles
- Assignee: University of Southern California
- Current Assignee: University of Southern California
- Current Assignee Address: US CA Los Angeles
- Agency: McDermott Will & Emery LLP
- Main IPC: A61K38/00
- IPC: A61K38/00 ; A61K45/00
Abstract:
A wound healing composition comprising a class of polypeptide compounds having a polypeptide chain with 5 to 120 amino acid units per chain. The composition includes a pharmaceutical medium to carry the polypeptide compound, such as an aqueous solution, suspension, dispersion, salve, ointment, gel, cream, lotion, spray or paste. Additionally, a method of applying a wound healing composition comprising a class of polypeptide compounds having a polypeptide chain with 5 to 120 amino acid units per chain in a concentration of from about 1 μg/ml to about 100 μg/ml for a time sufficient to heal the wound is disclosed.
Public/Granted literature
- US20120329719A1 Methods of use of skin wound healing compositions Public/Granted day:2012-12-27
Information query
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