Invention Grant
US08455605B2 Resin composition for transparent encapsulation material and electronic device formed using the same
有权
用于透明封装材料的树脂组合物和使用其形成的电子器件
- Patent Title: Resin composition for transparent encapsulation material and electronic device formed using the same
- Patent Title (中): 用于透明封装材料的树脂组合物和使用其形成的电子器件
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Application No.: US13535673Application Date: 2012-06-28
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Publication No.: US08455605B2Publication Date: 2013-06-04
- Inventor: Sang-Ran Koh , June-Ho Shin , Hyun-Jung Ahn , Sung-Hwan Cha , Young-Eun Choi , Doo-Young Jung , Sang-Kyun Kim , Jong-Seob Kim
- Applicant: Sang-Ran Koh , June-Ho Shin , Hyun-Jung Ahn , Sung-Hwan Cha , Young-Eun Choi , Doo-Young Jung , Sang-Kyun Kim , Jong-Seob Kim
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: Cheil Industries, Inc.
- Current Assignee: Cheil Industries, Inc.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2009-0136185 20091231
- Main IPC: C08G77/60
- IPC: C08G77/60
Abstract:
A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2,
Public/Granted literature
- US20120270998A1 RESIN COMPOSITION FOR TRANSPARENT ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE FORMED USING THE SAME Public/Granted day:2012-10-25
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