Invention Grant
- Patent Title: Curable liquid composite light emitting diode encapsulant
- Patent Title (中): 可固化液体复合发光二极管密封剂
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Application No.: US13211363Application Date: 2011-08-17
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Publication No.: US08455607B2Publication Date: 2013-06-04
- Inventor: Weijun Zhou , Binghe Gu , John W. Lyons , Allen S. Bulick , Garo Khanarian , Paul J. Popa , John R. Ell
- Applicant: Weijun Zhou , Binghe Gu , John W. Lyons , Allen S. Bulick , Garo Khanarian , Paul J. Popa , John R. Ell
- Applicant Address: US MA Marlborough US MI Midland
- Assignee: Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- Current Assignee Address: US MA Marlborough US MI Midland
- Agent Thomas S. Deibert
- Main IPC: C08G77/00
- IPC: C08G77/00
Abstract:
A curable liquid polysiloxane/TiO2 composite for use as a light emitting diode encapsulant is provided, comprising: a polysiloxane with TiO2 domains having an average domain size of less than 5 nm, wherein the curable liquid polysiloxane/TiO2 composite contains 20 to 60 mol % TiO2 (based on total solids); wherein the curable liquid polysiloxane/TiO2 composite exhibits a refractive index of >1.61 to 1.7 and wherein the curable liquid polysiloxane/TiO2 composite is a liquid at room temperature and atmospheric pressure. Also provided is a light emitting diode manufacturing assembly.
Public/Granted literature
- US20130045292A1 Curable liquid composite light emitting diode encapsulant Public/Granted day:2013-02-21
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