Invention Grant
- Patent Title: Integral ac module grounding system
- Patent Title (中): 集成交流模块接地系统
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Application No.: US12846057Application Date: 2010-07-29
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Publication No.: US08455752B2Publication Date: 2013-06-04
- Inventor: Charles Steven Korman , Neil Anthony Johnson
- Applicant: Charles Steven Korman , Neil Anthony Johnson
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Seema S. Katragadda
- Main IPC: H05K5/02
- IPC: H05K5/02

Abstract:
A photovoltaic (PV) ac-module grounding system includes a plurality of PV dc-voltage modules. Each PV dc-voltage module is integrated with a corresponding dc-ac micro-inverter to provide a corresponding PV ac-voltage module. Each PV ac-voltage module includes an ac-voltage plug and play connector that includes a dc ground conductor. Each dc-ac micro-inverter is internally electrically connected to its own chassis ground or metal enclosure which in turn is electrically connected to a corresponding dc ground conductor. A dc ground path is carried through an ac power bus from ac-voltage module to ac-voltage module through the plug and play connectors via the dc ground conductors.
Public/Granted literature
- US20120024563A1 INTEGRAL AC MODULE GROUNDING SYSTEM Public/Granted day:2012-02-02
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