Invention Grant
- Patent Title: Printed circuit board module
- Patent Title (中): 印刷电路板模块
-
Application No.: US13218017Application Date: 2011-08-25
-
Publication No.: US08455767B2Publication Date: 2013-06-04
- Inventor: Susumu Eguchi , Kazuhiko Itakura
- Applicant: Susumu Eguchi , Kazuhiko Itakura
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Main IPC: H05K1/03
- IPC: H05K1/03

Abstract:
As a base, a side wall, and a top board are integrated by integral molding in a printed circuit board module, the printed circuit board module is structured in a simple manner. Further, conductive terminals are used for fitting a printed circuit board. The printed circuit board is securely held between the electrically conductive terminals and the top board via an elasticity of the conductive terminals. Here, due to the functioning of the notches, the printed circuit board is positioned in a simple manner. Due to the functioning of the base, a printed circuit board module can stand erect. The printed circuit board establishes a vertical posture. The packaging area is reduced. The packaging density improves. Further, the flat surface of the top board that is formed facing upward with a certain extension is used as, for example, an absorbent face.
Public/Granted literature
- US20110308839A1 PRINTED CIRCUIT BOARD MODULE Public/Granted day:2011-12-22
Information query