Invention Grant
- Patent Title: Electronic component and method of mounting the same
- Patent Title (中): 电子部件及其安装方法
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Application No.: US12840421Application Date: 2010-07-21
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Publication No.: US08455769B2Publication Date: 2013-06-04
- Inventor: Yosuke Matsushita , Mitsutoshi Imamura , Yukio Yamamoto
- Applicant: Yosuke Matsushita , Mitsutoshi Imamura , Yukio Yamamoto
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-019838 20080130
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H01G4/05
Abstract:
An electronic component achieves significantly improved adhesion strength between an external electrode and a substrate body and includes an insulative substrate body, at least one groove disposed in at least one main surface of the substrate body, at least one external electrode disposed on the at least one main surface of the substrate body, wherein a portion of the at least one external electrode is disposed in at least a portion of the groove.
Public/Granted literature
- US20100276190A1 ELECTRONIC COMPONENT AND METHOD OF MOUNTING THE SAME Public/Granted day:2010-11-04
Information query
