A laser processing apparatus in which a workpiece is placed on a work support base that supports the workpiece at a plurality of support points and performs, while moving a processing head in a horizontal direction with respect to the workpiece, laser processing on the workpiece on the work support base by the processing head, includes a tilt judging unit that judges, based on a positional relationship between a product chip that is to be separated from the workpiece when the workpiece is subjected to laser processing and support points, whether the product chip tilts in a height direction and projects upward on a side of the processing head from the workpiece before laser processing; and a drive control unit that controls a height of the processing head with respect to the workpiece when moving the processing head to a processing position for a next product chip after completing laser processing on the product chip based on a judgment result of the tilt judging unit.