Invention Grant
- Patent Title: Electronic devices having plastic substrates
- Patent Title (中): 具有塑料基板的电子设备
-
Application No.: US13131379Application Date: 2009-11-30
-
Publication No.: US08455872B2Publication Date: 2013-06-04
- Inventor: Ian French
- Applicant: Ian French
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips Electronics N.V.
- Current Assignee: Koninklijke Philips Electronics N.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP08170863 20081205
- International Application: PCT/IB2009/055399 WO 20091130
- International Announcement: WO2010/064185 WO 20100610
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L23/58 ; H01L21/00
Abstract:
A method of manufacturing a thin film electronic device comprises applying a first plastic coating (PI-1) directly to a rigid carrier substrate (40) and forming thin film electronic elements (44) over the first plastic coating. A second plastic coating (46) is applied over the thin film electronic elements with electrodes (47) on top, with a portion lying directly over the associated electronic element, spaced by the second plastic coating. The rigid carrier substrate (40) is released from the first plastic coating, by a laser release process. This method enables traditional materials to be used as the base for the electronic element manufacture, for example thin film transistors. The second plastic coating can form part of the known field shielded pixel (FSP) technology.
Public/Granted literature
- US20110227086A1 ELECTRONIC DEVICES HAVING PLASTIC SUBSTRATES Public/Granted day:2011-09-22
Information query
IPC分类:
