Invention Grant
- Patent Title: Light emitting device package and light unit including the same
- Patent Title (中): 发光装置封装和包括其的灯单元
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Application No.: US13346320Application Date: 2012-01-09
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Publication No.: US08455891B2Publication Date: 2013-06-04
- Inventor: Dong Yong Lee
- Applicant: Dong Yong Lee
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR10-2011-0064097 20110629
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
An LED package includes a body; a first lead frame having a first cavity in the body; a second lead frame having a second cavity in the body; a first bonding part protruding into a region between a first lateral side of the body and the first cavity from the first lead frame; a second bonding part protruding into a region between a second lateral side of the body, and the second cavity from the second lead frame; a first LED in the first cavity; a second LED in the second cavity; a third lead frame disposed between the first lateral side and the first cavity; a fourth lead frame disposed between the second lateral side and the second cavity; a first protective device on one of the third lead frame and the first bonding part; and a second protective device on one of the fourth lead frame and the second bonding part.
Public/Granted literature
- US20130001599A1 LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT INCLUDING THE SAME Public/Granted day:2013-01-03
Information query
IPC分类:
