Invention Grant
- Patent Title: Method of manufacturing light emitting diode packaging lens and light emitting diode package
- Patent Title (中): 制造发光二极管封装透镜和发光二极管封装的方法
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Application No.: US12585642Application Date: 2009-09-21
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Publication No.: US08455910B2Publication Date: 2013-06-04
- Inventor: Chung-I Chiang , Tsan Lu , Hung-Yi Lin , Hsien-Lung Ho
- Applicant: Chung-I Chiang , Tsan Lu , Hung-Yi Lin , Hsien-Lung Ho
- Applicant Address: TW Taoyuan
- Assignee: Walsin Lihwa Corporation
- Current Assignee: Walsin Lihwa Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Chen Yoshimura LLP
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.
Public/Granted literature
- US20110068356A1 Method of manufacturing light emitting diode packaging lens and light emmiting diode package Public/Granted day:2011-03-24
Information query
IPC分类:
