Invention Grant
- Patent Title: Light emitting device
- Patent Title (中): 发光装置
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Application No.: US13362762Application Date: 2012-01-31
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Publication No.: US08455915B2Publication Date: 2013-06-04
- Inventor: Masaki Hayashi
- Applicant: Masaki Hayashi
- Applicant Address: JP Anan-Shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2011-020283 20110202
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
The light emitting device according to the present invention includes a resin molded body having a recess, a first electrically conductive member and a second electrically conductive member each having terminal portions respectively exposed from a first outer side surface and second outer side surface which are opposite outer side surfaces among the outer side surfaces of the resin molded body, and a light emitting element mounted on the first electrically conductive member exposed at a bottom surface of the recess. The recess has a first bottom surface on which the light emitting element is mounted and a second bottom surface arranged at a higher position of the outer periphery of the first bottom surface.
Public/Granted literature
- US20120228662A1 LIGHT EMITTING DEVICE Public/Granted day:2012-09-13
Information query
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