Invention Grant
US08455970B2 Lead frame assembly, package structure and LED package structure
有权
引线框架组装，封装结构和LED封装结构
- Patent Title: Lead frame assembly, package structure and LED package structure
- Patent Title (中): 引线框架组装，封装结构和LED封装结构
-
Application No.: US12654947Application Date: 2010-01-11
-
Publication No.: US08455970B2Publication Date: 2013-06-04
- Inventor: Chen-Hsiu Lin
- Applicant: Chen-Hsiu Lin
- Applicant Address: CN Guangzhou TW Taipei
- Assignee: Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On TECHNOLOGY Corp.
- Current Assignee: Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On TECHNOLOGY Corp.
- Current Assignee Address: CN Guangzhou TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: CN200910037562 20090226
- Main IPC: H01L31/0203
- IPC: H01L31/0203 ; H01L23/495
Abstract:
A package structure is adapted for mounting at least one light emitting diode (LED) die. The package structure includes an insulating housing having a top surface that is formed with a cavity, and a lead frame unit. The lead frame unit includes a first lead frame portion and a second lead frame portion. The first lead frame portion is covered by the insulating housing, and has a die-bonding area exposed within the cavity and adapted for mounting the LED die. The second lead frame portion is covered by the insulating housing, and has a conductive surface exposed outwardly of the top surface of the insulating housing and adapted for electrical connection with an end of a conductive wire.
Public/Granted literature
- US20100213484A1 Lead frame assembly, package structure and LED package structure Public/Granted day:2010-08-26
Information query
IPC分类:
