Invention Grant
- Patent Title: Flip-chip photodiode
- Patent Title (中): 倒装芯片光电二极管
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Application No.: US13584457Application Date: 2012-08-13
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Publication No.: US08455972B2Publication Date: 2013-06-04
- Inventor: Tony Maryfield , Mahyar Dadkhah , Thomas Davidson
- Applicant: Tony Maryfield , Mahyar Dadkhah , Thomas Davidson
- Applicant Address: US CA San Diego
- Assignee: Cubic Corporation
- Current Assignee: Cubic Corporation
- Current Assignee Address: US CA San Diego
- Agency: Kilpatrick Stockton & Townsend, LLP
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
A photodiode is provided according to various embodiments. In some embodiments, the photodiode includes a substrate and an active region. The active region is configured to receive light through the substrate. In such a configuration, the substrate not only participates in the photodiode operation acts as a light filter depending on the substrate material. In some embodiments, the active region may include solder balls that may be used to couple the photodiode to a printed circuit board. In some embodiments, the active region is coupled face-to-face with the printed circuit board.
Public/Granted literature
- US20120306036A1 FLIP-CHIP PHOTODIODE Public/Granted day:2012-12-06
Information query
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