Invention Grant
US08455975B2 Parasitic PNP bipolar transistor in a silicon-germanium BiCMOS process
有权
硅锗BiCMOS工艺中的寄生PNP双极晶体管
- Patent Title: Parasitic PNP bipolar transistor in a silicon-germanium BiCMOS process
- Patent Title (中): 硅锗BiCMOS工艺中的寄生PNP双极晶体管
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Application No.: US13228305Application Date: 2011-09-08
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Publication No.: US08455975B2Publication Date: 2013-06-04
- Inventor: Donghua Liu , Wensheng Qian
- Applicant: Donghua Liu , Wensheng Qian
- Applicant Address: CN Shanghai
- Assignee: Shanghai Hua Hong NEC Electronics Co., Ltd.
- Current Assignee: Shanghai Hua Hong NEC Electronics Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Blakely Sokoloff Taylor & Zafman
- Priority: CN201010278159 20100910
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L29/10 ; H01L29/40 ; H01L29/47 ; H01L29/66

Abstract:
A parasitic PNP bipolar transistor, wherein a base region includes a first and a second region; the first region is formed in an active area, has a depth larger than shallow trench field oxides, and has its bottom laterally extended into the bottom of the shallow trench field oxides on both sides of an active area; the second region is formed in an upper part of the first region and has a higher doping concentration; an N-type and a P-type pseudo buried layer is respectively formed at the bottom of the shallow trench field oxides; a deep hole contact is formed on top of the N-type pseudo buried layer to pick up the base; the P-type pseudo buried layer forms a collector region separated from the active area by a lateral distance; an emitter region is formed by a P-type SiGe epitaxial layer formed on top of the active area.
Public/Granted literature
- US20120061793A1 PARASITIC PNP BIPOLAR TRANSISTOR IN A SILICON-GERMANIUM BICMOS PROCESS Public/Granted day:2012-03-15
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