Invention Grant
US08455989B2 Package substrate having die pad with outer raised portion and interior recessed portion
有权
封装基板，具有具有外部凸起部分和内部凹陷部分的管芯焊盘
- Patent Title: Package substrate having die pad with outer raised portion and interior recessed portion
- Patent Title (中): 封装基板，具有具有外部凸起部分和内部凹陷部分的管芯焊盘
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Application No.: US13175587Application Date: 2011-07-01
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Publication No.: US08455989B2Publication Date: 2013-06-04
- Inventor: Chih-Chien Ho , Saihsi Jen , Eric Hsieh
- Applicant: Chih-Chien Ho , Saihsi Jen , Eric Hsieh
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
An electronic assembly includes a substrate including a die pad, where the die pad includes and an outer raised flat portion and a recessed portion that includes an inner recessed portion. A semiconductor die is directly on the outer raised flat portion and affixed to the die pad by a die attach material that is in the inner recessed portion. The die attach material is not on a top surface of the outer raised flat portion.
Public/Granted literature
- US20130001760A1 PACKAGE SUBSTRATE HAVING DIE PAD WITH OUTER RAISED PORTION AND INTERIOR RECESSED PORTION Public/Granted day:2013-01-03
Information query
IPC分类:
