Invention Grant
- Patent Title: Semiconductor package and method of fabricating the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US13013912Application Date: 2011-01-26
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Publication No.: US08455992B2Publication Date: 2013-06-04
- Inventor: Woojin Chang
- Applicant: Woojin Chang
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2010-0099315 20101012
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/50
Abstract:
Provided is a semiconductor package and a method of fabricating the same. The semiconductor package includes: a package body including a plurality of sheets; semiconductor chips mounted in the package body; and an external connection terminal provided on a first side of the package body, wherein the sheets are stacked in a parallel direction to the first side.
Public/Granted literature
- US20120086118A1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME Public/Granted day:2012-04-12
Information query
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