The electronic module comprises a dielectric 1031 substrate having a first surface and a second surface and an installation cavity extending through the dielectric substrate and having a perimetrical side wall. The electronic module further comprises a first wiring layer 1032 on the first surface, a second wiring layer 1033 on the second surface, and a feed through conductor 1034 on the perimetrical side wall and electrically connecting at least one conductor in the first wiring layer to at least one conductor in the second wiring layer. There is also at least one IC inside the installation cavity. The electronic module further comprises a first insulating layer 1035 on the second wiring layer, a second insulating layer 1036 on the first wiring layer, and a third wiring layer 1037 on the first insulating layer. First microvias 1038 inside the first insulating layer make electrical connections between the second wiring layer and the third wiring layer. Second microvias 1039 electrically connect the IC to at least one of the second wiring layer and the third wiring layer. The electronic module comprises also a fourth wiring layer 1040 on the second insulating layer and third microvias 1041 inside the second insulating layer and making electrical connections between the first wiring layer and the fourth wiring layer.