Invention Grant
- Patent Title: Weldable contact and method for the production thereof
- Patent Title (中): 可焊接触及其制造方法
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Application No.: US11817554Application Date: 2006-02-09
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Publication No.: US08456022B2Publication Date: 2013-06-04
- Inventor: Robert Hammedinger , Konrad Kastner , Martin Maier , Michael Obesser
- Applicant: Robert Hammedinger , Konrad Kastner , Martin Maier , Michael Obesser
- Applicant Address: DE Munich
- Assignee: Epcos AG
- Current Assignee: Epcos AG
- Current Assignee Address: DE Munich
- Agency: Fish & Richardson P.C.
- Priority: DE102005009358 20050301
- International Application: PCT/EP2006/001160 WO 20060209
- International Announcement: WO2006/092200 WO 20060908
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part of the pad metallization. The under bump metallization is in an area for receiving solder. The pad metallization is structured to reveal parts of the substrate surface. The under bump metallization is in direct contact with the parts of the substrate.
Public/Granted literature
- US20090020325A1 WELDABLE CONTACT AND METHOD FOR THE PRODUCTION THEREOF Public/Granted day:2009-01-22
Information query
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