A semiconductor integrated circuit device includes a semiconductor chip including input/output cells, pads formed on a surface of the semiconductor chip, and interconnects formed on the surface of the semiconductor chip to electrically connect at least some of the plurality of input/output cells and at least some of the plurality of pads. A first plurality of the pads located in a center portion of the semiconductor chip are arranged in a rectangular dot grid pattern, and a second plurality of the pads located in at least one of four corner portions of the semiconductor chip are arranged in a staggered dot pattern.