Invention Grant
- Patent Title: Shunt switch, semiconductor device, module and electronic device
- Patent Title (中): 分流开关，半导体器件，模块和电子器件
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Application No.: US12838526Application Date: 2010-07-19
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Publication No.: US08456037B2Publication Date: 2013-06-04
- Inventor: Akira Akiba , Koichi Ikeda
- Applicant: Akira Akiba , Koichi Ikeda
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sony Corporation
- Priority: JP2009-175190 20090728
- Main IPC: G05F1/10
- IPC: G05F1/10 ; H01H51/34
Abstract:
A shunt switch allowed to improve isolation, a semiconductor device, a module and an electronic device each of which includes the shunt switch are provided. The shunt switch includes: a transmission line, a ground; and a shunt line electrically coupling the transmission line and the ground, in which two or more of the shunt lines are arranged in parallel to one another, and an impedance between the two or more shunt lines is higher than an impedance of the transmission line.
Public/Granted literature
- US20110024273A1 SHUNT SWITCH, SEMICONDUCTOR DEVICE, MODULE AND ELECTRONIC DEVICE Public/Granted day:2011-02-03
Information query
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