Invention Grant
US08456169B2 High speed measurement of random variation/yield in integrated circuit device testing
失效
集成电路设备测试中随机变化/产量的高速测量
- Patent Title: High speed measurement of random variation/yield in integrated circuit device testing
- Patent Title (中): 集成电路设备测试中随机变化/产量的高速测量
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Application No.: US12686476Application Date: 2010-01-13
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Publication No.: US08456169B2Publication Date: 2013-06-04
- Inventor: Manjul Bhushan , Mark B. Ketchen , Qingqing Liang , Edward P. Maciejewski
- Applicant: Manjul Bhushan , Mark B. Ketchen , Qingqing Liang , Edward P. Maciejewski
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Ian MacKinnon
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
A test structure is provided that utilizes a time division sampling technique along with a statistical modeling technique that uses metal-oxide-semiconductor field effect transistor (MOSFET) saturation and linear characteristics to measure the mean (average) and sigma (statistical characterization of the variation) of a large population of electrical characteristics of electrical devices (e.g., integrated circuits) at high speed. Such electrical characteristics or sampling parameters include drive currents, leakage, resistances, etc.
Public/Granted literature
- US20110169499A1 HIGH SPEED MEASUREMENT OF RANDOM VARIATION/YIELD IN INTEGRATED CIRCUIT DEVICE TESTING Public/Granted day:2011-07-14
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