Invention Grant
- Patent Title: Probe card for a semiconductor wafer
- Patent Title (中): 半导体晶圆探针卡
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Application No.: US12450145Application Date: 2008-03-12
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Publication No.: US08456184B2Publication Date: 2013-06-04
- Inventor: Yoshio Yamada , Hiroshi Nakayama , Mitsuhiro Nagaya , Tsuyoshi Inuma , Takashi Akao
- Applicant: Yoshio Yamada , Hiroshi Nakayama , Mitsuhiro Nagaya , Tsuyoshi Inuma , Takashi Akao
- Applicant Address: JP Yokohama-shi
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Yokohama-shi
- Agency: Edwards Wildman Palmer LLP
- Priority: JP2007-065651 20070314
- International Application: PCT/JP2008/054498 WO 20080312
- International Announcement: WO2008/126601 WO 20081023
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R31/00

Abstract:
A probe card is provided that is capable of accurately ensuring the flatness and the parallelism with respect to a predetermined reference surface. A point (Q) of application of force applied from a leaf spring (17) that presses a portion near an edge portion of a surface of a probe head (15) from which a plurality of probes projects over an entire circumference in a direction of a substrate to the probe head (15) is positioned inside of an outer edge of the probe head (15), and a point (P) of application of force applied from the retainer (16) that presses a portion near an edge portion of a space transformer (14) over an entire circumference in the direction of the substrate to the space transformer (14) is positioned inside of an outer edge of the space transformer (14).
Public/Granted literature
- US20100164518A1 PROBE CARD Public/Granted day:2010-07-01
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