Invention Grant
- Patent Title: Micro-scale system to provide thermal isolation and electrical communication between substrates
- Patent Title (中): 微尺度系统提供基板之间的热隔离和电气通信
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Application No.: US13105735Application Date: 2011-05-11
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Publication No.: US08456249B2Publication Date: 2013-06-04
- Inventor: Jeffrey F. DeNatale , Philip A. Stupar , Yu-Hua Lin , Robert L. Borwick , Alexandros P. Papavasiliou
- Applicant: Jeffrey F. DeNatale , Philip A. Stupar , Yu-Hua Lin , Robert L. Borwick , Alexandros P. Papavasiliou
- Applicant Address: US CA Thousand Oaks
- Assignee: Teledyne Scientific & Imaging, LLC.
- Current Assignee: Teledyne Scientific & Imaging, LLC.
- Current Assignee Address: US CA Thousand Oaks
- Agency: Brooks Acordia IP Law, PC
- Main IPC: H01S1/06
- IPC: H01S1/06 ; H03B17/00
Abstract:
A microscale apparatus includes a microscale rigidized Parylene strap having a reinforcement structure extending from a first side of the strap, a first silicon substrate suspended by the microscale rigidized Parylene strap, the microscale rigidized Parylene strap conformally coupled to the first substrate, and a second substrate conformally coupled to the microscale rigidized Parylene strap to suspend the first silicon substrate through the microscale rigidized Parylene strap.
Public/Granted literature
- US20120286884A1 Micro-scale System to Provide Thermal Isolation and Electrical Communication Between Substrates Public/Granted day:2012-11-15
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