Invention Grant
- Patent Title: Sensor module
- Patent Title (中): 传感器模块
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Application No.: US12676624Application Date: 2008-08-28
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Publication No.: US08456317B2Publication Date: 2013-06-04
- Inventor: Rainer Stegmann , Heribert Werner
- Applicant: Rainer Stegmann , Heribert Werner
- Applicant Address: DE
- Assignee: Magna Electronics Europe GmbH & Co KG
- Current Assignee: Magna Electronics Europe GmbH & Co KG
- Current Assignee Address: DE
- Agency: Gardner, Linn, Burkhart & Flory, LLP
- Priority: DE102007042694 20070907
- International Application: PCT/DE2008/001421 WO 20080828
- International Announcement: WO2009/030198 WO 20090312
- Main IPC: G08B23/00
- IPC: G08B23/00

Abstract:
A sensor module is mounted at a windshield of a vehicle. The sensor module can be connected, via a fastening section that is arranged on a module housing, to an element that is fixed to the vehicle body or to an element which is connected to a part that is fixed to the vehicle body. A sensor is accommodated in the module housing and is retained such that it can be displaced and/or pivoted from a first starting position into a second end position in order to rest against the windscreen. The adjusting movement can be initiated by an adjusting element which can be preloaded in the direction of the end position by means of a spring element and can be blocked in the starting position by means of a blocking element. Also, a delaying element is provided that can influence a parameter of the adjusting movement.
Public/Granted literature
- US20100308094A1 SENSOR MODULE Public/Granted day:2010-12-09
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