Invention Grant
- Patent Title: Housing and method for making the same
- Patent Title (中): 住房和制作方法
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Application No.: US12905213Application Date: 2010-10-15
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Publication No.: US08456370B2Publication Date: 2013-06-04
- Inventor: Kun-Tsan Wu , Li-Wen Tien
- Applicant: Kun-Tsan Wu , Li-Wen Tien
- Applicant Address: HK Kowloon
- Assignee: FIH (Hong Kong) Limited
- Current Assignee: FIH (Hong Kong) Limited
- Current Assignee Address: HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN201010211089 20100628
- Main IPC: H01Q1/24
- IPC: H01Q1/24
Abstract:
A housing includes a soft layer, a radiator element, and a main body. The radiator element is combined with the soft layer. The main body is attached to the soft layer, and the radiator element extends from the soft layer and the main body. The radiator element can be protected by the soft layer and the main body. In addition, textured material can be use for the soft layer to enhance appearance of an electronic device using the housing.
Public/Granted literature
- US20110316752A1 HOUSING AND METHOD FOR MAKING THE SAME Public/Granted day:2011-12-29
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