A touch pad module assembly structure includes a housing, a touch pad module and a metal bracket. The housing includes a generally rectangular opening. The touch pad module is assembled into the opening. The touch pad module includes a support member and a circuit board. An edge of the support member has a through hole and a pair of resilient members. An opposite edge of the support member has a connection member secured to a surrounding surface of the opening. The circuit board is disposed over the support member and includes a switch aligned with the through hole. The metal bracket is secured to a surrounding edge of the opening to be in to contact with the switch and expose the connection member.