Invention Grant
US08456546B2 Solid-state imaging device, signal processing device and signal processing method for solid-state imaging device, and imaging apparatus 有权
固态成像装置,固态成像装置的信号处理装置和信号处理方法以及成像装置

  • Patent Title: Solid-state imaging device, signal processing device and signal processing method for solid-state imaging device, and imaging apparatus
  • Patent Title (中): 固态成像装置,固态成像装置的信号处理装置和信号处理方法以及成像装置
  • Application No.: US13537653
    Application Date: 2012-06-29
  • Publication No.: US08456546B2
    Publication Date: 2013-06-04
  • Inventor: Yusuke Oike
  • Applicant: Yusuke Oike
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: The Chicago Technology Law Group, LLC
  • Agent Robert J. Denke
  • Priority: JP2007-137540 20070524
  • Main IPC: H04N5/217
  • IPC: H04N5/217 H04N5/228 H04N9/68
Solid-state imaging device, signal processing device and signal processing method for solid-state imaging device, and imaging apparatus
Abstract:
A solid-state imaging device includes a pixel array unit in which unit pixels are arranged in a matrix shape and a signal processing circuit that obtains a first video signal and performs processing for combining the first and second video signals. The signal processing circuit includes judging means that judges whether a pixel of interest in the pixel array unit is a pixel to be saturated during an exposure period, calculating means that sets the pixel of interest as a correction pixel and calculates a correction amount on the basis of a luminance value of the second video signal of a peripheral pixel of the correction pixel, and correcting means that applies the correction amount to a luminance value of the first video signal of the correction pixel to thereby correct a noise signal amount due to photo-charges leaking from the peripheral pixel into the correction pixel.
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