Invention Grant
US08456546B2 Solid-state imaging device, signal processing device and signal processing method for solid-state imaging device, and imaging apparatus
有权
固态成像装置,固态成像装置的信号处理装置和信号处理方法以及成像装置
- Patent Title: Solid-state imaging device, signal processing device and signal processing method for solid-state imaging device, and imaging apparatus
- Patent Title (中): 固态成像装置,固态成像装置的信号处理装置和信号处理方法以及成像装置
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Application No.: US13537653Application Date: 2012-06-29
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Publication No.: US08456546B2Publication Date: 2013-06-04
- Inventor: Yusuke Oike
- Applicant: Yusuke Oike
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: The Chicago Technology Law Group, LLC
- Agent Robert J. Denke
- Priority: JP2007-137540 20070524
- Main IPC: H04N5/217
- IPC: H04N5/217 ; H04N5/228 ; H04N9/68

Abstract:
A solid-state imaging device includes a pixel array unit in which unit pixels are arranged in a matrix shape and a signal processing circuit that obtains a first video signal and performs processing for combining the first and second video signals. The signal processing circuit includes judging means that judges whether a pixel of interest in the pixel array unit is a pixel to be saturated during an exposure period, calculating means that sets the pixel of interest as a correction pixel and calculates a correction amount on the basis of a luminance value of the second video signal of a peripheral pixel of the correction pixel, and correcting means that applies the correction amount to a luminance value of the first video signal of the correction pixel to thereby correct a noise signal amount due to photo-charges leaking from the peripheral pixel into the correction pixel.
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